CU AND ZN FILMS PRODUCED WITH AN ANODIC VACUUM-ARC

被引:11
作者
MAUSBACH, M
EHRICH, H
MULLER, KG
机构
[1] Institut für Laser und Plasmaphysik, Universität Gesamthochschule Essen, 4300 Essen 1
关键词
D O I
10.1016/0042-207X(90)93967-N
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A steady vacuum arc discharge with a consumable anode, the anodic vacuum arc, was used to produce thin Cu and Zn films. This new type of discharge is ignited in vacuum (≤ 10-2 Pa) and is sustained by metal vapor produced at the anode. In contrast to the well-known vacuum arcs with consumable cathodes no micro-particles are ejected from the evaporating anode. Deposition rates range from 23 to 65 nm s-1. The thin metallic films are homogeneous and show bulk density. The purity of the deposited metallic films is up to 99.9% and the electric conductivity is close that of the respective bulk material. © 1990.
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收藏
页码:1393 / 1395
页数:3
相关论文
共 14 条
[2]   EFFECTS OF ARGON PRESSURE AND SUBSTRATE-TEMPERATURE ON THE STRUCTURE AND PROPERTIES OF SPUTTERED COPPER-FILMS [J].
CRAIG, S ;
HARDING, GL .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (02) :205-215
[3]  
EHRICH H, 1988, VAKUUM-TECH, V37, P176
[4]   THE ANODIC VACUUM-ARC .2. EXPERIMENTAL-STUDY OF ARC PLASMA [J].
EHRICH, H ;
HASSE, B ;
MULLER, KG ;
SCHMIDT, R .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (04) :2499-2503
[5]   THE ANODIC VACUUM-ARC .1. BASIC CONSTRUCTION AND PHENOMENOLOGY [J].
EHRICH, H .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (01) :134-138
[6]  
EHRICH H, IN PRESS
[7]   A REVIEW OF THE PRESENT UNDERSTANDING OF THE ROLE OF ION SURFACE INTERACTIONS AND PHOTOINDUCED REACTIONS DURING VAPOR-PHASE CRYSTAL-GROWTH [J].
GREENE, JE ;
MOTOOKA, T ;
SUNDGREN, JE ;
ROCKETT, A ;
GORBATKIN, S ;
LUBBEN, D ;
BARNETT, SA .
JOURNAL OF CRYSTAL GROWTH, 1986, 79 (1-3) :19-32
[8]  
KATSCH HM, 1990, J APPL PHYS, V67
[9]  
Maissel L.I., 1970, HDB THIN FILM TECHNO, P13
[10]  
MARTIN PJ, 1984, J APPL PHYS, V55, P253