RESIDUAL-STRESSES IN POLYMERIC PASSIVATION AND ENCAPSULATION MATERIALS

被引：8

作者：

NOYAN, IC

NGUYEN, LT

机构：

[1] IBM, United States

来源：

POLYMER ENGINEERING AND SCIENCE | 1988年 / 28卷 / 16期

关键词：

D O I：

10.1002/pen.760281603

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

引用

页码：1026 / 1033

页数：8

共 23 条

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