ELECTROLESS NICKEL PLATING FOR MAKING OHMIC CONTACTS TO SILICON

被引：158

作者：

SULLIVAN, MV

EIGLER, JH

机构：

来源：

关键词：

D O I：

10.1149/1.2428541

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：226 / 230

页数：5

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[4]

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[5]

BRENNER A, 1947, P AM ELECTROPLAT SOC, V34, P156

[6]

EISENBERG PH, 1955, PLATING, V42, P1268

[7] DIFFUSION OF DONOR AND ACCEPTOR ELEMENTS IN SILICON [J].

FULLER, CS ;

DITZENBERGER, JA .

[8]

HAAS J, 1955, AM MACHINIST, V99, P158

[9]

PESSEL L, 1947, Patent No. 2430581

[10] 5 METAL HYDRIDES AS ALLOYING AGENTS ON SILICON [J].

SULLIVAN, MV ;

EIGLER, JH .