AN INTERACTIVE COMPUTER-SIMULATION OF HEATING AND COOLING A ROW OF SILICON-WAFERS

被引：13

作者：

TAVEL, MA ^{[1
]}

HEARN, EW ^{[1
]}

机构：

[1] IBM CORP,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533

来源：

关键词：

D O I：

10.1149/1.2095948

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1266 / 1271

页数：6

共 7 条

[1] CLOSED BOAT - NEW APPROACH FOR SEMICONDUCTOR BATCH PROCESSING
HEARN, EW
TEKAAT, EH
SCHWUTTKE, GH
[J]. MICROELECTRONICS AND RELIABILITY, 1976, 15 (01): : 61 - 66
[2] DISLOCATIONS IN THERMALLY STRESSED SILICON WAFERS
HU, SM
[J]. APPLIED PHYSICS LETTERS, 1973, 22 (05) : 261 - 264
[3] ANALYSIS OF THE TEMPERATURE DISTRIBUTION IN FZ SILICON-CRYSTALS
KUIKEN, HK
ROKSNOER, PJ
[J]. JOURNAL OF CRYSTAL GROWTH, 1979, 47 (01) : 29 - 42
[4] WARPAGE OF SILICON-WAFERS
LEROY, B
PLOUGONVEN, C
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (04) : 961 - 970
[5] MCADAMS WH, 1954, HEAT TRANSMISSION, P177
[6] DEFORMATION AND FRACTURE OF SMALL SILICON CRYSTALS
PEARSON, GL
READ, WT
FELDMANN, WL
[J]. ACTA METALLURGICA, 1957, 5 (04): : 181 - 191
[7] WANG CT, 1953, APPLIED ELASTICITY, P54