INVESTIGATION OF SURFACE-ROUGHNESS AND HILLOCK FORMATION ON PLATINIZED SUBSTRATES USED FOR PT/PZT/PT CAPACITOR FABRICATION

被引:8
作者
KNEER, EA
BIRNIE, DP
SCHRIMPF, RD
PODLESNY, JC
TEOWEE, G
机构
[1] UNIV ARIZONA,DEPT ELECT & COMP ENGN,TUCSON,AZ 85721
[2] WYKO CORP,TUCSON,AZ 85706
[3] DONNELLY CORP,TUCSON,AZ 85712
关键词
D O I
10.1080/10584589508220221
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hillock formation on Pt bottom electrode surfaces has been investigated for <111> Si and sapphire substrates. This paper correlates the electrical performance of Pt/PZT/Pt structured capacitors with the observed surface roughness and/or hillock presence on the Pt bottom electrode.
引用
收藏
页码:61 / 73
页数:13
相关论文
共 7 条
  • [1] BRUCHHAUS R, 1991, MATER RES SOC S P, V243, P123
  • [2] HREN PD, 1991, 3RD P INT S INT FERR, P612
  • [3] Kneer E. A., 1994, Ferroelectrics, V152, P67, DOI 10.1080/00150199408017598
  • [4] EFFECTS OF ANNEAL AMBIENTS AND PT THICKNESS ON PT/TI AND PT/TI/TIN INTERFACIAL REACTIONS
    OLOWOLAFE, JO
    JONES, RE
    CAMPBELL, AC
    HEGDE, RI
    MOGAB, CJ
    GREGORY, RB
    [J]. JOURNAL OF APPLIED PHYSICS, 1993, 73 (04) : 1764 - 1772
  • [5] Revesz P., 1991, MATER RES SOC S P, V243, P101
  • [6] PREPARATION AND FERROELECTRIC PROPERTIES OF PBZR0.53TI0.47O3 THIN-FILMS BY SPIN COATING AND METALORGANIC DECOMPOSITION
    SPIERINGS, GACM
    ULENAERS, MJE
    KAMPSCHOER, GLM
    VANHAL, HAM
    LARSEN, PK
    [J]. JOURNAL OF APPLIED PHYSICS, 1991, 70 (04) : 2290 - 2298
  • [7] INVESTIGATION OF PT/TI BILAYER METALLIZATION ON SILICON FOR FERROELECTRIC THIN-FILM INTEGRATION
    SREENIVAS, K
    REANEY, I
    MAEDER, T
    SETTER, N
    JAGADISH, C
    ELLIMAN, RG
    [J]. JOURNAL OF APPLIED PHYSICS, 1994, 75 (01) : 232 - 239