EFFECTS OF INTERMETALLIC FORMATION AT THE INTERFACE BETWEEN COPPER AND LEAD TIN SOLDER

[1] BADER WG, 1969, WELD J, V48, pS551

[2] Berg H., 1973, P 11 RELIABILITY PHY, P10

[3] BLICKENSDERFER R, 1984, J TEST EVAL, V12, P3, DOI 10.1520/JTE11414J

[4] DEHAVEN PW, 1984, IBMEF52 INT REP

[5] DEHAVEN PW, 1983, ADV XRAY ANAL, V27

[6] FIDOS H, 1970, Z METALLKD, V61, P225

[7] HAGSTROM RA, 1969, P TECHNICAL PROGRAMM, P271

[8] GROWTH-KINETICS OF INTERMETALLIC PHASES AT THE LIQUID SN AND SOLID NI INTERFACE [J]. SCRIPTA METALLURGICA, 1980, 14 (04): : 421 - 424

[9] SOLDERING EXTERNAL CONNECTIONS TO THIN-FILM SYSTEMS [J]. SURFACE AND INTERFACE ANALYSIS, 1981, 3 (01) : 16 - 22

[10] MEISSNER HP, 1951, T ASME, V73, P697

[1] BADER WG, 1969, WELD J, V48, pS551

[2] Berg H., 1973, P 11 RELIABILITY PHY, P10

[3] BLICKENSDERFER R, 1984, J TEST EVAL, V12, P3, DOI 10.1520/JTE11414J

[4] DEHAVEN PW, 1984, IBMEF52 INT REP

[5] DEHAVEN PW, 1983, ADV XRAY ANAL, V27

[6] FIDOS H, 1970, Z METALLKD, V61, P225

[7] HAGSTROM RA, 1969, P TECHNICAL PROGRAMM, P271

[8] GROWTH-KINETICS OF INTERMETALLIC PHASES AT THE LIQUID SN AND SOLID NI INTERFACE [J]. SCRIPTA METALLURGICA, 1980, 14 (04): : 421 - 424

[9] SOLDERING EXTERNAL CONNECTIONS TO THIN-FILM SYSTEMS [J]. SURFACE AND INTERFACE ANALYSIS, 1981, 3 (01) : 16 - 22

[10] MEISSNER HP, 1951, T ASME, V73, P697