DIAMOND DEVICE DELINEATION VIA EXCIMER-LASER PATTERNING

被引:25
作者
JOHNSTON, C [1 ]
CHALKER, PR [1 ]
BUCKLEYGOLDER, IM [1 ]
MARSDEN, PJ [1 ]
WILLIAMS, SW [1 ]
机构
[1] BRITISH AEROSP PLC, SOWERBY RES CTR, BRISTOL BS12 7QW, ENGLAND
关键词
D O I
10.1016/0925-9635(93)90233-R
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Excimer lasers are high peak power gas lasers, commonly operating in the UV region of the electromagnetic spectrum, i.e. between 157 and 351 nm. They have been extensively applied to patterning and machining of high performance materials, such as polymers and fibre-reinforced composites. The use of high power, UV excimer lasers offers an alternative route for structure delineation in electronic device fabrication, by providing a resist-free, patterned processing capability. This is in contrast to conventional etching processes, such as wet chemical, reactive ion or plasma-assisted methods. The effect of excimer laser radiation on chemical-vapour-deposited diamond has been studied to find the optimum conditions for device patterning. The effect of chemical-vapour-deposited diamond film quality (amount of sp3-bonded carbon) on the etch rates and laser processing parameters (power, pulse rate and wavelength) also have been examined. A tentative mechanism for the ablation of diamond has been proposed.
引用
收藏
页码:829 / 834
页数:6
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