INTERMETALLIC EMBRITTLEMENT OF THIN UNSUPPORTED TIN COPPER SPECIMENS

被引：2

作者：

FREEMAN, GB ^{[1
]}

LIVESAY, BR ^{[1
]}

BRADLEY, J ^{[1
]}

XU, Y ^{[1
]}

ONEIL, EG ^{[1
]}

机构：

[1] MVA INC,NORCROSS,GA 30093

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 09期

关键词：

BRITTLE FRACTURE; INTERMETALLIC PRECIPITATES; SN/CU; STRAIN TENSILE TESTS;

D O I：

10.1007/BF02655365

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thin, unsupported vacuum-cast tin samples were prepared and, after half of the samples were coated with a thin layer of evaporated copper, stressed to failure using a specialized tensile testing apparatus. The samples were examined optically and by analytical scanning and transmission electron microscopy. Samples coated with copper exhibited very different mechanical behavior than did the uncoated tin samples which exhibited simple ductile behavior. Post-failure examination of the specimens shows that the differences in mechanical behavior are not due to the copper coating, but, in fact, due to copper-tin intermetallics formed within the bulk of the tin.

引用

页码：919 / 924

页数：6

共 6 条

[1] THE EFFECT OF CU6SN5 WHISKER PRECIPITATES IN BULK 60SN-40PB SOLDER [J].