STRAIN SENSITIVITY OF THICK-FILM RESISTORS

被引：39

作者：

SHAH, JS

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1980.1135645

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：554 / 564

页数：11

共 13 条

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MICROELECTRONICS AND RELIABILITY, 1973, 12 (04) :395-396

[3]

Jentzsch J., 1976, Wissenschaftliche Berichte AEG-Telefunken, V49, P229

[4]

KUMMER F, 1977, SEP P INT C THIN THI, P28

[5]

Machin W. S., 1978, MATER SCI RES, V11, P243

[6]

MOWERY GW, 1954, PROPERTIES GLASS, P272

PIKE, GE ;

SEAGER, CH .

[8]

SEAGER CH, 1975, SAND750019 SAND LAB, P28

[9]

SHAH J, UNPUBLISHED

[10] MATERIAL CHARACTERIZATION OF THICK FILM-RESISTOR PASTES [J].

SHAH, JS ;

HAHN, WC .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (04) :383-392