BENZOCYCLOBUTENE INTERLAYER DIELECTRICS FOR THIN-FILM MULTICHIP MODULES

被引：19

作者：

JOHNSON, RW

PHILLIPS, TL

WEIDNER, WK

HAHN, SF

BURDEAUX, DC

TOWNSEND, PH

机构：

[1] DOW CHEM CO USA,ME PRUITT RES CTR,CENT RES,MAT SCI & DEV LAB,MIDLAND,MI 48674

[2] DOW CHEM CO USA,MICHIGAN DIV,MICHIGAN APPL SCI & TECHNOL LAB,MIDLAND,MI 48674

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 02期

关键词：

D O I：

10.1109/33.56168

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new organic dielectric derived from benzocyclobutene has been investigated as an interlayer dielectric for thin film multichip modules. The material is processed using standard semiconductor techniques. Key attributes of the polymer are: a low dielectric constant (2.7), low moisture absorption (0.2–0.3%), low processing temperature (250°C), good chemical resistance, and high thermal stability (approximately 350°C). © 1990 IEEE

引用

页码：347 / 352

页数：6

共 14 条

[1] MULTICHIP PACKAGING DESIGN FOR VLSI-BASED SYSTEMS [J].