ELECTRICAL PERFORMANCE OF HIGH-SPEED INTERCONNECT SYSTEMS

被引：10

作者：

SCHEINFEIN, MR

LIAO, JC

PALUSINSKI, OA

PRINCE, JL

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 03期

关键词：

D O I：

10.1109/TCHMT.1987.1134765

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：303 / 309

页数：7

共 13 条

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[6] ELECTRICAL MODELING OF INTERCONNECTIONS IN MULTILAYER PACKAGING STRUCTURES [J].

PALUSINSKI, OA ;

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[7] LOWER AND UPPER BOUND CALCULATIONS ON THE CAPACITANCE OF MULTICONDUCTOR PRINTED TRANSMISSION-LINE USING THE SPECTRAL-DOMAIN APPROACH AND VARIATIONAL METHOD [J].

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