ELECTROLESS COPPER DEPOSITION ON METALS AND METAL SILICIDES

[1] Agens M. C, 1960, US-American Patent, Patent No. 2938805

[2] [Anonymous], 1966, ATLAS ELECTROCHEMICA

[3] BAUM TH, J ELECTROCHEM SOC, V137, P252

[4] MECHANISMS OF ELECTROLESS METAL PLATING .2. FORMALDEHYDE OXIDATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (11) : 2581 - 2589

[5] Bindra P, 1990, AM ELECTROPLATERS SO, P289

[6] DEEP ULTRAVIOLET LITHOGRAPHY OF MONOLAYER FILMS WITH SELECTIVE ELECTROLESS METALLIZATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (06) : 1677 - 1680

[7] CALVERT JM, 1991, SOLID STATE TECHNOL, V34, P77

[8] Cho J. S. H., 1991, 1991 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.91CH3017-1), P39, DOI 10.1109/VLSIT.1991.705979

[9] ELECTROLESS CU FOR VLSI [J]. MRS BULLETIN, 1993, 18 (06) : 31 - 38

[10] FLOTTMANN T, 1989, MATER RES SOC S P, V167, P309

[1] Agens M. C, 1960, US-American Patent, Patent No. 2938805

[2] [Anonymous], 1966, ATLAS ELECTROCHEMICA

[3] BAUM TH, J ELECTROCHEM SOC, V137, P252

[4] MECHANISMS OF ELECTROLESS METAL PLATING .2. FORMALDEHYDE OXIDATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (11) : 2581 - 2589

[5] Bindra P, 1990, AM ELECTROPLATERS SO, P289

[6] DEEP ULTRAVIOLET LITHOGRAPHY OF MONOLAYER FILMS WITH SELECTIVE ELECTROLESS METALLIZATION [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (06) : 1677 - 1680

[7] CALVERT JM, 1991, SOLID STATE TECHNOL, V34, P77

[8] Cho J. S. H., 1991, 1991 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.91CH3017-1), P39, DOI 10.1109/VLSIT.1991.705979

[9] ELECTROLESS CU FOR VLSI [J]. MRS BULLETIN, 1993, 18 (06) : 31 - 38

[10] FLOTTMANN T, 1989, MATER RES SOC S P, V167, P309