MINIATURE HYBRID MICROWAVE ICS USING A NOVEL THIN-FILM TECHNOLOGY

被引：15

作者：

EDA, K ^{[1
]}

MIWA, T ^{[1
]}

TAGUCHI, Y ^{[1
]}

UWANO, T ^{[1
]}

机构：

[1] MATSUSHITA ELECT IND CO LTD,IMAGE TECHNOL RES LAB,KADOMA,OSAKA 571,JAPAN

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1990年 / 38卷 / 12期

关键词：

D O I：

10.1109/22.64579

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel thin-film technology for miniature hybrid microwave IC's is presented. All passive components, such as resistors and capacitors, are fully integrated on ordinary alumina ceramic substrates using the thin-film technology with very high yield. The numbers of parts and wiring processes were significantly reduced. This technology was applied to the fabrication of Ku-band solid-state power amplifiers.

引用

页码：1949 / 1956

页数：8

共 9 条

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