CONTROL OF THE DEPOSITION TEMPERATURE BY THE USE OF A MAGNETIC-FIELD IN RF-SPUTTERING

被引：8

作者：

OUNADJELA, K

SURAN, G

SZTERN, J

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(87)90138-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：397 / 402

页数：6

共 7 条

[1]

FAU JC, 1975, J ELECTROCHEM SOC SO, V122, P1719

[2]

HERTE L, 1969, J VAC SCI TECHNOL, V6, P351

[3] TEMPERATURE RISE DURING FILM DEPOSITION BY RF AND DC SPUTTERING [J].

LAU, SS ;

MILLS, RH ;

MUTH, DG .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (04) :1196-&

[4] SPUTTERING MULTILAYERED CONDUCTOR FILMS [J].

MUTH, DG .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1971, 8 (01) :99-&

SURAN, G ;

OUNADJELA, K ;

MACHIZAUD, F .

[6]

WEHNER GK, 1970, HDB THIN FILM TECHNO, pCH3

[7]

1963, AM I PHYSICS HDB