SPUTTERING MULTILAYERED CONDUCTOR FILMS

被引：21

作者：

MUTH, DG

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1971年 / 8卷 / 01期

关键词：

D O I：

10.1116/1.1316372

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：99 / &

共 12 条

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[2] SUBSTRATE BOMBARDMENT DURING RF SPUTTERING [J].

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[3]

CHOPRA KL, 1969, THIN FILM PHENOMENA, P316

[4] DIELECTRIC THIN FILMS THROUGH RF SPUTTERING [J].

DAVIDSE, PD ;

MAISSEL, LI .

JOURNAL OF APPLIED PHYSICS, 1966, 37 (02) :574-&

[5]

GERRITSEN AN, 1950, HANDBUCH PHYSIK, V19, P210

[6]

HALL PG, UNPUBLISHED RESULTS

[7] RF SPUTTERING OF MULTILAYER THIN FILMS [J].

HERTE, L ;

LANG, A ;

MYERS, DO .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (01) :109-&

[8]

HEURLE FM, 1966, T AIME, V236, P321

[9] REDUCTION OF SUBSTRATE HEATING DURING RF SPUTTERING [J].

LAMONT, LT ;

LANG, A .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1970, 7 (01) :198-&

[10] TANTALUM-FILM TECHNOLOGY [J].

MCLEAN, DA ;

SCHWARTZ, N ;

TIDD, ED .

PROCEEDINGS OF THE IEEE, 1964, 52 (12) :1450-&

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