THERMOMIGRATION OF LIQUID WIRES

被引：10

作者：

CLINE, HE

ANTHONY, TR

机构：

来源：

JOURNAL OF APPLIED PHYSICS | 1978年 / 49卷 / 05期

关键词：

D O I：

10.1063/1.325157

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：2777 / 2786

页数：10

共 16 条

[1] DEEP-DIODE ARRAYS [J].

ANTHONY, TR ;

CLINE, HE .

JOURNAL OF APPLIED PHYSICS, 1976, 47 (06) :2550-2557

[2] THERMAL MIGRATION OF LIQUID DROPLETS THROUGH SOLIDS [J].

ANTHONY, TR ;

CLINE, HE .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (09) :3380-&

[3] RANDOM-WALK OF LIQUID DROPLETS MIGRATING IN SILICON [J].

ANTHONY, TR ;

CLINE, HE .

JOURNAL OF APPLIED PHYSICS, 1976, 47 (06) :2316-2324

[4] STABILITY OF MIGRATING DROPLETS IN SOLIDS [J].

ANTHONY, TR ;

CLINE, HE .

ACTA METALLURGICA, 1973, 21 (02) :117-122

[5]

ANTHONY TR, 1976, IEEE T ELECTRON DEVI, V32, P818

[6]

Cline H. E., 1972, Journal of Crystal Growth, V13-14, P790, DOI 10.1016/0022-0248(72)90561-1

[7] MIGRATION ON FINE MOLTEN WIRES IN THIN SILICON WAFERS [J].

CLINE, HE ;

ANTHONY, TR .

JOURNAL OF APPLIED PHYSICS, 1978, 49 (04) :2412-2419

[8] NON-EQUILIBRIUM MORPHOLOGY OF LIQUID INCLUSIONS MIGRATING IN SOLIDS [J].

CLINE, HE ;

ANTHONY, TR .

JOURNAL OF APPLIED PHYSICS, 1977, 48 (12) :5096-5104

[9] THERMOMIGRATION OF ALUMINUM-RICH LIQUID WIRES THROUGH SILICON [J].

CLINE, HE ;

ANTHONY, TR .

JOURNAL OF APPLIED PHYSICS, 1976, 47 (06) :2332-2336

[10]

Gibbs J.W., 1928, COLLECTED WORKS

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