THERMOMIGRATION OF ALUMINUM-RICH LIQUID WIRES THROUGH SILICON

被引：30

作者：

CLINE, HE ^{[1
]}

ANTHONY, TR ^{[1
]}

机构：

[1] GE,CTR RES & DEV,SCHENECTADY,NY 12308

来源：

关键词：

D O I：

10.1063/1.323009

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：2332 / 2336

页数：5

共 24 条

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ANTHONY, TR ;

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[3]

ANTHONY TR, 1975, Patent No. 3904442

[4]

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[5]

ANTHONY TR, 1975, Patent No. 3895967

[6]

ANTHONY TR, 1975, Patent No. 3901736

[7]

BRODER JD, 1963, J ELCHEM SO, V110, P1151

[8] THERMOMIGRATION OF ALUMINUM-RICH LIQUID DROPLETS IN SILICON [J].

CLINE, HE ;

ANTHONY, TR .

[9] INTERFACE STABILITY IN TEMPERATURE GRADIENT ZONE-MELTING [J].

CLINE, HE ;

ANTHONY, TR .

ACTA METALLURGICA, 1973, 21 (05) :547-557

[10]

CLINE HE, 1975, Patent No. 3899361