ELIMINATING INDUCTIVE NOISE OF EXTERNAL CHIP INTERCONNECTIONS

被引：11

作者：

RAINAL, AJ

机构：

[1] AT&T Bell Laboratories, Murray Hill

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1994年 / 29卷 / 02期

关键词：

D O I：

10.1109/4.272116

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

On-chip balanced drivers can essentially eliminate inductive noise, without any power dissipation penalty, and independently of the number of chip drivers switching simultaneously or the switching speed. In addition, balanced interconnections on PWB's and MCM's substantially reduce crosstalk, increase noise immunity, and eliminate ground noise.

引用

页码：126 / 129

页数：4

共 6 条

[1] THE DESIGN OF THE ES/9000 MODULE [J].