OPTOELECTRONIC PACKAGING USING SILICON SURFACE-MICROMACHINED ALIGNMENT MIRRORS

被引：43

作者：

SOLGAARD, O

DANEMAN, M

TIEN, NC

FRIEDBERGER, A

MULLER, RS

LAU, KY

机构：

[1] Department of Electrical Engineering and Cornputer Science, Berkeley Sensor and Actuator Center, University of California, Berkeley

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 1995年 / 7卷 / 01期

关键词：

D O I：

10.1109/68.363382

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-fiber (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 mu m, and we achieve repeatable 45% coupling efficiency with good mechanical stability.

引用

页码：41 / 43

页数：3

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