ON THE PINNING OF GRAIN-BOUNDARY MOTION BY SURFACE GROOVES

被引:9
作者
SANCHEZ, JE
ARZT, E
机构
[1] Max-Planck-Institut für Metallforschung, Institut für Werkstoffwissenschaft
来源
SCRIPTA METALLURGICA ET MATERIALIA | 1992年 / 26卷 / 09期
关键词
D O I
10.1016/0956-716X(92)90643-S
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
[No abstract available]
引用
收藏
页码:1325 / 1330
页数:6
相关论文
共 8 条
[1]  
BECK PA, 1948, T AM I MIN MET ENG, V175, P372
[2]   GRAIN-SIZE DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURES IN NARROW INTERCONNECTS [J].
CHO, J ;
THOMPSON, CV .
APPLIED PHYSICS LETTERS, 1989, 54 (25) :2577-2579
[3]   GRAIN-BOUNDARY GROOVING AT FINITE GRAIN-SIZE [J].
HACKNEY, SA ;
OJARD, GC .
SCRIPTA METALLURGICA, 1988, 22 (11) :1731-1735
[4]   THE EFFECT OF THERMAL GROOVING ON GRAIN BOUNDARY MOTION [J].
MULLINS, WW .
ACTA METALLURGICA, 1958, 6 (06) :414-427
[5]   THEORY OF THERMAL GROOVING [J].
MULLINS, WW .
JOURNAL OF APPLIED PHYSICS, 1957, 28 (03) :333-339
[6]   GRAIN-GROWTH AND GRAIN-SIZE DISTRIBUTIONS IN THIN GERMANIUM FILMS [J].
PALMER, JE ;
THOMPSON, CV ;
SMITH, HI .
JOURNAL OF APPLIED PHYSICS, 1987, 62 (06) :2492-2497
[7]  
SANCHEZ JE, 1991, JUN P INT C GRAIN GR
[8]   EFFECT OF TEXTURE AND GRAIN-STRUCTURE ON ELECTROMIGRATION IN AL-0.5-PERCENT CU THIN-FILMS [J].
VAIDYA, S ;
SINHA, AK .
THIN SOLID FILMS, 1981, 75 (03) :253-259