MECHANISMS OF INTERDIFFUSION IN COPPER NICKEL THIN-FILM COUPLES

被引:45
作者
JOHNSON, BC [1 ]
BAUER, CL [1 ]
JORDAN, AG [1 ]
机构
[1] CARNEGIE MELLON UNIV,CTR STUDY MAT,PITTSBURGH,PA 15213
关键词
D O I
10.1063/1.336552
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:1147 / 1155
页数:9
相关论文
共 37 条
[1]   QUENCHED-IN LATTICE VACANCIES IN COPPER [J].
AIROLDI, G ;
BACCHELLA, GL ;
GERMAGNOLI, E .
PHYSICAL REVIEW LETTERS, 1959, 2 (04) :145-146
[2]  
Barrer R.M., 1941, DIFFUSION SOLIDS, P19
[3]  
BAUER CL, 1978, PHYS STATUS SOLIDI A, V48, P555
[4]   STRUCTURE OF VAPOR-DEPOSITED COPPER [J].
BAUER, RW ;
SCHWARTZ.AM ;
DANTONIO, C .
THIN SOLID FILMS, 1968, 2 (5-6) :529-&
[5]   ROLE OF STRUCTURAL DEFECTS IN ELECTRON-TRANSPORT PROPERTIES OF COPPER-FILMS [J].
CHOPRA, KL ;
SURI, R ;
THAKOOR, AP .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (02) :538-546
[6]  
Coleman M. G., 1980, Fourteenth IEEE Photovoltaic Specialists Conference 1980, P793
[7]  
Crank J., 1975, MATH DIFFUSION, Vsecond, P47
[8]   CALCULATION OF MIGRATION AND BINDING ENERGIES OF MONOVACANCIES, DIVACANCIES AND TRIVANCACIES IN COPPER WITH THE USE OF A MORSE FUNCTION [J].
DAMASK, AC ;
DIENES, GJ ;
WEIZER, VG .
PHYSICAL REVIEW, 1959, 113 (03) :781-784
[9]   GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS .1. ISOLATED GRAIN-BOUNDARY [J].
GILMER, GH ;
FARRELL, HH .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (09) :3792-3798
[10]   GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS .2. MULTIPLE GRAIN-BOUNDARIES AND SURFACE-DIFFUSION [J].
GILMER, GH ;
FARRELL, HH .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (10) :4373-4380