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A PIEZOELECTRIC MICROPUMP BASED ON MICROMACHINING OF SILICON
被引:453
作者
:
VANLINTEL, HTG
论文数:
0
引用数:
0
h-index:
0
机构:
UNIV TWENTE,TRANSDUCERS & MAT SCI GRP,POB 217,7500 AE ENSCHEDE,NETHERLANDS
VANLINTEL, HTG
VANDEPOL, FCM
论文数:
0
引用数:
0
h-index:
0
机构:
UNIV TWENTE,TRANSDUCERS & MAT SCI GRP,POB 217,7500 AE ENSCHEDE,NETHERLANDS
VANDEPOL, FCM
BOUWSTRA, S
论文数:
0
引用数:
0
h-index:
0
机构:
UNIV TWENTE,TRANSDUCERS & MAT SCI GRP,POB 217,7500 AE ENSCHEDE,NETHERLANDS
BOUWSTRA, S
机构
:
[1]
UNIV TWENTE,TRANSDUCERS & MAT SCI GRP,POB 217,7500 AE ENSCHEDE,NETHERLANDS
[2]
CTR MICROELECTR TWENTE,7500 AM ENSCHEDE,NETHERLANDS
[3]
UNIV TWENTE,SENSORS & ACTUATORS RES GRP,7500 AE ENSCHEDE,NETHERLANDS
来源
:
SENSORS AND ACTUATORS
|
1988年
/ 15卷
/ 02期
关键词
:
All Open Access;
Green;
D O I
:
10.1016/0250-6874(88)87005-7
中图分类号
:
O65 [分析化学];
学科分类号
:
070302 ;
081704 ;
摘要
:
PIEZOELECTRIC DEVICES
引用
收藏
页码:153 / 167
页数:15
相关论文
共 9 条
[1]
BOUWSTRA S, 1986, 3RD P SENS ACT S NET, P199
[2]
LOW ENERGY METAL-GLASS BONDING
DENEE, PB
论文数:
0
引用数:
0
h-index:
0
机构:
USM Corporation, Research Division, Beverly
DENEE, PB
[J].
JOURNAL OF APPLIED PHYSICS,
1969,
40
(13)
: 5396
-
&
[3]
MULDER JCM, 1984, THESIS U TWENTE NETH
[4]
SILICON AS A MECHANICAL MATERIAL
PETERSEN, KE
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP, RES LAB, SAN JOSE, CA 95193 USA
IBM CORP, RES LAB, SAN JOSE, CA 95193 USA
PETERSEN, KE
[J].
PROCEEDINGS OF THE IEEE,
1982,
70
(05)
: 420
-
457
[5]
SMITS JG, 1985, Patent No. 8302860
[6]
TIMOSHENKO S, 1950, THEORY PLATES SHELLS, P364
[7]
Timoshenko S. P., 1950, THEORY PLATES SHELLS, P51
[8]
FIELD ASSISTED GLASS-METAL SEALING
WALLIS, G
论文数:
0
引用数:
0
h-index:
0
机构:
P. R. Mallory and Co. Inc., Burlington
WALLIS, G
POMERANT.DI
论文数:
0
引用数:
0
h-index:
0
机构:
P. R. Mallory and Co. Inc., Burlington
POMERANT.DI
[J].
JOURNAL OF APPLIED PHYSICS,
1969,
40
(10)
: 3946
-
&
[9]
YOUNGS MODULUS SHEAR MODULUS AND POISSONS RATIO IN SILICON AND GERMANIUM
WORTMAN, JJ
论文数:
0
引用数:
0
h-index:
0
WORTMAN, JJ
EVANS, RA
论文数:
0
引用数:
0
h-index:
0
EVANS, RA
[J].
JOURNAL OF APPLIED PHYSICS,
1965,
36
(01)
: 153
-
+
←
1
→
共 9 条
[1]
BOUWSTRA S, 1986, 3RD P SENS ACT S NET, P199
[2]
LOW ENERGY METAL-GLASS BONDING
DENEE, PB
论文数:
0
引用数:
0
h-index:
0
机构:
USM Corporation, Research Division, Beverly
DENEE, PB
[J].
JOURNAL OF APPLIED PHYSICS,
1969,
40
(13)
: 5396
-
&
[3]
MULDER JCM, 1984, THESIS U TWENTE NETH
[4]
SILICON AS A MECHANICAL MATERIAL
PETERSEN, KE
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP, RES LAB, SAN JOSE, CA 95193 USA
IBM CORP, RES LAB, SAN JOSE, CA 95193 USA
PETERSEN, KE
[J].
PROCEEDINGS OF THE IEEE,
1982,
70
(05)
: 420
-
457
[5]
SMITS JG, 1985, Patent No. 8302860
[6]
TIMOSHENKO S, 1950, THEORY PLATES SHELLS, P364
[7]
Timoshenko S. P., 1950, THEORY PLATES SHELLS, P51
[8]
FIELD ASSISTED GLASS-METAL SEALING
WALLIS, G
论文数:
0
引用数:
0
h-index:
0
机构:
P. R. Mallory and Co. Inc., Burlington
WALLIS, G
POMERANT.DI
论文数:
0
引用数:
0
h-index:
0
机构:
P. R. Mallory and Co. Inc., Burlington
POMERANT.DI
[J].
JOURNAL OF APPLIED PHYSICS,
1969,
40
(10)
: 3946
-
&
[9]
YOUNGS MODULUS SHEAR MODULUS AND POISSONS RATIO IN SILICON AND GERMANIUM
WORTMAN, JJ
论文数:
0
引用数:
0
h-index:
0
WORTMAN, JJ
EVANS, RA
论文数:
0
引用数:
0
h-index:
0
EVANS, RA
[J].
JOURNAL OF APPLIED PHYSICS,
1965,
36
(01)
: 153
-
+
←
1
→