FREE CONVECTION COOLING OF ELECTRONIC SYSTEMS

被引：27

作者：

AUNG, W ^{[1
]}

KESSLER, TJ ^{[1
]}

BEITIN, KI ^{[1
]}

机构：

[1] BELL TEL LABS INC,WHIPPANY,NJ 07881

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1973年 / PHP9卷 / 02期

关键词：

D O I：

10.1109/TPHP.1973.1136712

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：75 / 86

页数：12

共 26 条

[1] DEVELOPING LAMINAR FREE CONVECTION BETWEEN VERTICAL FLAT PLATES WITH ASYMMETRIC HEATING
AUNG, W
SERNAS, V
FLETCHER, LS
[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1972, 15 (11) : 2293 - &
[2] FULLY DEVELOPED LAMINAR FREE CONVECTION BETWEEN VERTICAL PLATES HEATED ASYMMETRICALLY
AUNG, W
[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1972, 15 (08) : 1577 - &
[3] AUNG W, 1973, BELL SYST TECH J, V52
[4] AUNG W, 1972, AUG ASME AICHE NAT H
[5] AUNG W, 1972, NOV ASME WINT ANN M
[6] LIQUID COOLING OF MICROELECTRONIC DEVICES BY FREE AND FORCED CONVECTION
BAKER, E
[J]. MICROELECTRONICS AND RELIABILITY, 1972, 11 (02): : 213 - &
[7] BASIULIS A, 1969, ASME69HT25 PAP
[8] Bodoia J.R., 1962, ASME J HEAT TRANSF, V84, P40, DOI [10.1115/1.3684288, DOI 10.1115/1.3684288]
[9] BODOIA JR, 1959, THESIS CARNEGIE MELL
[10] CHU RC, 1969, MICROELECTRON, V2, P32