GRAIN-BOUNDARY DIFFUSION AND RECRYSTALLIZATION IN CU-PB THIN-FILMS

被引：4

作者：

CAMPISANO, SU ^{[1
]}

COSTANZO, E ^{[1
]}

RIMINI, E ^{[1
]}

机构：

[1] UNIV CATANIA,INST STRUTTURA MAT,I-95129 CATANIA,ITALY

来源：

PHILOSOPHICAL MAGAZINE | 1977年 / 35卷 / 05期

关键词：

D O I：

10.1080/14786437708232956

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1333 / 1344

页数：12

共 14 条

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[3] CAHN RW, 1974, PHYS METALLURGY, P1129
[4] CAMPISANO SU, 1976, ION BEAM SURFACE LAY, V2, P585
[5] CHU WK, 1973, THINS SOLID FILMS, V13, P123
[6] INTERSTITIAL DIFFUSION OF COPPER AND SILVER IN LEAD
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ANTHONY, T
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[J]. JOURNAL OF APPLIED PHYSICS, 1966, 37 (06) : 2370 - &
[7] HANSEN M, 1958, CONSTITUTION BINARY, P609
[8] STUDIES ON AL2O3-TI-MO-AU METALLIZATION SYSTEM
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CAMPISANO, SU
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (01): : 524 - 527
[9] HIRTH JP, 1969, PHYS THIN FILMS, V3, P60
[10] DIFFUSION OF COPPER IN LEAD - SOLUBILITY AND ISOTOPE-EFFECT
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[J]. PHYSICAL REVIEW B, 1974, 10 (06): : 2275 - 2280