STRESS-RELAXATION IN TIN-LEAD SOLDERS

被引：24

作者：

BAKER, E

机构：

[1] School of Mechanical Engineering, N.S.W. Institute of Technology, Sydney

来源：

MATERIALS SCIENCE AND ENGINEERING | 1979年 / 38卷 / 03期

关键词：

D O I：

10.1016/0025-5416(79)90128-9

中图分类号：

T [工业技术];

学科分类号：

120111 [工业工程];

摘要：

Compressive stress relaxation in four hypereutectic tin-lead alloys was studied to establish parameters for an analytical model which can be used at very low strain rates. The experimental results exhibited little experimental scatter and were consistent between all the tests. At these low strain rates the activation enthalpy and the stress exponent were found to be 67 kJ mol-1 and 3.4 respectively. These values were found to be independent of both temperature and composition. In addition a unique stress relaxation relation was found which correlated the data for all the alloys tested. © 1979.

引用

页码：241 / 247

页数：7

共 5 条

[1]

INFLUENCE OF TEMPERATURE ON STRESS RELAXATION IN A CHILL-CAST, TIN-LEAD SOLDER [J].