SOME EFFECTS OF TEMPERATURE ON MATERIAL PROPERTIES AND DEVICE RELIABILITY

被引：7

作者：

BAKER, E

机构：

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1972年 / PHP8卷 / 04期

关键词：

D O I：

10.1109/TPHP.1972.1136585

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：4 / &

共 24 条

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[6]

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[7]

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REE, T .

[9]

FOX A, 1971, IEEE T PARTS MATERIA, VPMP7, P34

[10]

HARPER CA, 1969, HDB ELECTRONIC PACKA