MAXIMIZING STEP COVERAGE DURING BLANKET TUNGSTEN LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION

被引:3
作者
CALE, TS [1 ]
JAIN, MK [1 ]
RAUPP, GB [1 ]
机构
[1] ARIZONA STATE UNIV, CTR SOLID STATE ELECTR RES, TEMPE, AZ 85287 USA
基金
美国国家科学基金会;
关键词
D O I
10.1016/S0040-6090(05)80011-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A significant range of step coverages can be realized in the low pressure chemical vapor deposition of blanket tungsten films by either hydrogen reduction or silane reduction of tungsten hexafluoride, at a specified deposition rate. The step coverage realized in a single-wafer reactor (SWR) depends on the operating conditions used, e.g. feed flow rate ratios and reactant conversion level. The pseudosteady state approximation to the diffusion-reaction model is used to select the partial pressure ratios at the wafer surface which lead to a balance between reactant availability and consumption. The complete transient model is then used to demonstrate that the reactant pressure ratio obtained using this "availability analysis" maximizes the step coverage at a specified deposition rate. The reactant pressure ratio at the feature mouth is related to the inlet feed rate ratio and reactor conversion level for an SWR, assuming a well-mixed reactor. Guidelines for SWR operation are given to obtain the maximum step coverage for each system. In well-mixed reactors, the optimum feed ratio is a linear function of conversion, and approaches the stoichiometric ratio as the conversion approaches unity.
引用
收藏
页码:51 / 60
页数:10
相关论文
共 14 条
[1]   PROGRAMMED RATE PROCESSING TO INCREASE THROUGHPUT IN LPCVD [J].
CALE, TS ;
JAIN, MK ;
RAUPP, GB .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (05) :1526-1533
[2]  
CALE TS, 1989, TUNGSTEN OTHER REFRA, V4, P183
[3]  
CALE TS, 1990, TUNGSTEN OTHER ADV M, V5, P179
[4]   PREDICTION OF STEP COVERAGE DURING BLANKET CVD TUNGSTEN DEPOSITION IN CYLINDRICAL PORES [J].
CHATTERJEE, S ;
MCCONICA, CM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (01) :328-335
[5]  
Froment GF., 2010, CHEM REACTOR ANAL DE, V3
[6]  
INAMDAR A, 1990, TUNGSTEN OTHER REFRA, V5, P93
[7]  
KLEIJN CR, 1990, TUNGSTEN OTHER ADV M, V5, P109
[8]   THE KINETICS OF LPCVD TUNGSTEN DEPOSITION IN A SINGLE WAFER REACTOR [J].
MCCONICA, CM ;
KRISHNAMANI, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (12) :2542-2548
[9]  
MCCONICA CM, 1989, TUNGSTEN OTHER REFRA, V4, P197
[10]   Step Coverage Prediction in Low-Pressure Chemical Vapor Deposition [J].
Raupp, G. B. ;
Cale, T. S. .
CHEMISTRY OF MATERIALS, 1989, 1 (02) :207-214