DIFFUSION OF CN ON CU SURFACES

被引:147
作者
KARIMI, M
TOMKOWSKI, T
VIDALI, G
BIHAM, O
机构
[1] SYRACUSE UNIV,DEPT PHYS,SYRACUSE,NY 13244
[2] HEBREW UNIV JERUSALEM,RACAH INST PHYS,IL-94901 JERUSALEM,ISRAEL
来源
PHYSICAL REVIEW B | 1995年 / 52卷 / 07期
关键词
D O I
10.1103/PhysRevB.52.5364
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Diffusion of a single Cu adatom on low-index Cu surfaces with different morphologies (with and without the presence of other Ca adatoms as well as near and over stepped surfaces) is studied using the embedded-atom method and a molecular static simulation. Migration energies of a Cu adatom in the presence of other Cu adatoms which are relevant in computer simulations of island growth are calculated. We have also calculated the formation and migration energies of an adatom and a vacancy in different layers as well as formation energies of steps on various Cu surfaces. Step-step interaction is shown to be repulsive and consistent with elasticity theory. Our calculations predict a lower activation energy for diffusion of a vacancy than of an adatom for all three Cu surfaces.
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页码:5364 / 5374
页数:11
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