PHOTOCURABLE POLYMERS APPLIED AS ENCAPSULATING MATERIALS FOR ISFET PRODUCTION

被引：38

作者：

BRATOV, A ^{[1
]}

MUNOZ, J ^{[1
]}

DOMINGUEZ, C ^{[1
]}

BARTROLI, J ^{[1
]}

机构：

[1] CSIC,CTR NACL MICROELECTR,E-08193 BARCELONA,SPAIN

来源：

SENSORS AND ACTUATORS B-CHEMICAL | 1995年 / 25卷 / 1-3期

关键词：

ISFETS; PHOTOCURABLE POLYMERS; SENSOR PACKAGING;

D O I：

10.1016/0925-4005(95)85183-6

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

Promising materials for semiconductor-based chemical sensors are photocurable polymers that can be applied utilizing conventional photolithographic processes compatible with microelectronic technology. In this work different acrylate-based polymers curable under UV irradiation have been tested for their applicability as packaging materials. A mixture consisting of acrylate oligomer (epoxy, urethane, siloxane, polyester), reactive monomers and suitable photoinitiator is applied to a wire-bonded sensor chip to form a thick (100-1000 mu m) polymer layer. After exposure and development, a window is opened over the gate region. Results on polymer-layer adhesion, electrical resistivity, chemical resistance and lifetime of the encapsulated microsensors in various aqueous solutions are presented.

引用

页码：823 / 825

页数：3