MODELING AND SIMULATION OF INTERCONNECTION DELAYS AND CROSSTALKS IN HIGH-SPEED INTEGRATED-CIRCUITS

被引：75

作者：

GAO, DS ^{[1
]}

YANG, AT ^{[1
]}

KANG, SM ^{[1
]}

机构：

[1] UNIV WASHINGTON,DEPT ELECT ENGN,SEATTLE,WA 98195

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS | 1990年 / 37卷 / 01期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/31.45685

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The evaluation of transient electrical performance of interconnection lines is becoming increasingly more important in the analysis and design of high-speed integrated circuits. An accurate computer model for n parallel microstrip lines is developed for circuit simulation. Modal analysis is applied to decouple the n coupled line system into n independent lines and the characteristic solutions of Telegraph equations are modeled into a set of simple time-varying equivalent circuits. This model has been implemented into a general-purpose circuit simulator iSMILE compatible with SPICE. Simulation results on propagation delay times and crosstalks are presented for the case study of high speed GaAs HEMT integrated circuits. © 1990 IEEE

引用

页码：1 / 9

页数：9

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