ELECTROMIGRATION DAMAGE OF GRAIN-BOUNDARY TRIPLE POINTS IN A1 THIN FILMS

被引：41

作者：

BERENBAUM, L

机构：

来源：

JOURNAL OF APPLIED PHYSICS | 1971年 / 42卷 / 02期

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D O I：

10.1063/1.1660116

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

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页码：880 / +

页数：1

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[1] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS
ATTARDO, MJ
ROSENBERG, R
[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +
[2] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES
BERENBAUM, L
ROSENBERG, R
[J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +
[3] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS
BLACK, JR
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) : 338 - &
[4] ELECTROMIGRATION IN THIN AL FILMS
BLECH, IA
MEIERAN, ES
[J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &
[5] DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
BLECH, IA
MEIERAN, ES
[J]. APPLIED PHYSICS LETTERS, 1967, 11 (08) : 263 - &
[6] MOTION OF INCLUSION INDUCED BY A DIRECT CURRENT AND A TEMPERATURE GRADIENT
HO, PS
[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (01) : 64 - &
[7] VALUE D0Z' FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMS
ROSENBERG, R
[J]. APPLIED PHYSICS LETTERS, 1970, 16 (01) : 27 - +
[8] RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS
ROSENBERG, R
BERENBAUM, L
[J]. APPLIED PHYSICS LETTERS, 1968, 12 (05) : 201 - +