Atomic force microscopy (AFM) has been used to characterize the topography of the buried Si-SiO2 interface in Bonded, single-implant Separation by IMplantation of OXygen (SIMOX), and multiple-implant SIMOX silicon-on-insulator material. The properties of this interface have important implications for processing and for device performance. The root-mean-square surface roughness was found to be 11.4 nm for single-implant material, 2.9 nm for multiple-implant material, and less than 1.5 nm for bonded material.