SYNTHESIS AND CHARACTERIZATION OF SELF-METALLIZING GOLD-DOPED POLYIMIDE FILMS

被引:8
作者
CAPLAN, ML [1 ]
STOAKLEY, DM [1 ]
STCLAIR, AK [1 ]
机构
[1] NASA, LANGLEY RES CTR, HAMPTON, VA 23681 USA
关键词
D O I
10.1002/app.1995.070560813
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
State-of-the-art methods for producing reflective polymer films for space applications involve multiple steps, and the integrity of the metal-polymer interface is less than optimal. A more efficient; process was developed that consists of doping polyamic acid resins with gold additives and curing them to form self-metallizing polyimide films. Several moderately reflective, flexible metallic gold films were produced that have good thermal stability and mechanical properties, a strong metal-polymer interface, and in some cases, electrical conductivity. It was found that; the polymer system, gold additive, gold concentration, and heat treatment all affect the reflectivity, flexibility, and conductivity of the resulting polyimide films by affecting the degree of metallization of the film surface. (C) 1995 John Wiley and Sons, Inc.
引用
收藏
页码:995 / 1006
页数:12
相关论文
共 25 条
[1]  
BANKS BA, 1992, 24TH P INT SAMPE TEC, pT165
[2]  
BERNERSPRICE SJ, 1985, INORG CHEM, V24, P3425
[3]   ADHESION OF POLYIMIDES TO METAL AND CERAMIC SURFACES - AN OVERVIEW [J].
BUCHWALTER, LP .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1990, 4 (09) :697-721
[4]  
ENDREY AL, 1963, Patent No. 3073784
[5]   ELECTROLESS METALLIZATION OF ORGANIC POLYMERS USING THE POLYMER AS A REDOX REAGENT - REACTION OF POLYIMIDE WITH ZINTL ANIONS [J].
HAUSHALTER, RC ;
KRAUSE, LJ .
THIN SOLID FILMS, 1983, 102 (02) :161-171
[6]   INTERFACIAL REACTIONS IN POLYIMIDE METAL SYSTEMS [J].
IACONA, F ;
GARILLI, M ;
MARLETTA, G ;
PUGLISI, O ;
PIGNATARO, S .
JOURNAL OF MATERIALS RESEARCH, 1991, 6 (04) :861-870
[7]  
KIM J, 1990, MATER RES SOC SYMP P, V167, P137
[8]   ADHESION AND INTERFACE INVESTIGATION OF POLYIMIDE ON METALS [J].
KIM, YH ;
KIM, J ;
WALKER, GF ;
FEGER, C ;
KOWALCZYK, SP .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1988, 2 (02) :95-105
[9]   POLYIMIDE ON COPPER - THE ROLE OF SOLVENT IN THE FORMATION OF COPPER PRECIPITATES [J].
KOWALCZYK, SP ;
KIM, YH ;
WALKER, GF ;
KIM, J .
APPLIED PHYSICS LETTERS, 1988, 52 (05) :375-376
[10]   CHARACTERIZATION OF POLYIMIDE/METAL INTERFACES BY RBS, AES, XPS AND TEM [J].
Kurosaki, Kazuo ;
Watanabe, Hiroyuki ;
Maruyama, Tatsuya .
ANALYTICAL SCIENCES, 1991, 7 :1651-1654