EFFECTS OF PROCESSING ON RADIATION-DAMAGE IN SIO2

被引:45
作者
GDULA, RA
机构
[1] IBM Corporation, East Fishkill Facility, NY 12533, Hopewell Junction
关键词
D O I
10.1109/T-ED.1979.19472
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper briefly reviews the general interaction of radiation with thermally grown SiO2 both phenomenologically and atomistically. Radiation-induced trapped charge, the creation of fast surface states, and the all-important neutral electron traps are discussed. The types of radiation and their concomitant damage produced by the typical processes of ion implantation, reactive ion etching, and electron-beam lithography are outlined. The effect of these processes on the oxidized silicon system is treated, and process modification to minimize radiation damage is discussed. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.
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页码:644 / 647
页数:4
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