ANNEALING OF CYLINDRICAL NI-FE FILMS

The effect of annealing on the microstructure of cylindrical electrodeposited 81-percent Ni, 19-percent Fe films was studied with the electron microscope. The films were deposited onto 5-mil Be-Cu wires having either Au or Cu intermediate layers. The annealing was performed on both free-standing films and on films still attached to the substrate. The initial change in the free-standing films was a rapid recrystallization. After the whole film had re-crystallized, normal grain growth was observed. There is evidence that the driving force for the annealing is provided by stresses present in the films. Films annealed while attached to a Au-Be-Cu substrate did not exhibit recrystallization or grain growth, and the electron microscope studies showed that the Ni-Fe grains were pinned by Be-Au which diffuses into the grain boundaries but does not alloy with the Ni-Fe. The films which were annealed while attached to a Cu-Be-Cu substrate behaved essentially like freestanding films. Electron beam microanalysis and electron diffraction studies revealed that Be-Cu diffuses into the Ni-Fe grain boundaries and then alloys with the Ni-Fe. Recrystallization of the alloy can then take place freely. Copyright © 1969 by The Institute of Electrical and Electronics Engineers, Inc.