CORROSION PERFORMANCE OF LAYERED COATINGS PRODUCED BY PHYSICAL VAPOR-DEPOSITION

被引:79
作者
PARK, MJ
LEYLAND, A
MATTHEWS, A
机构
[1] Research Centre in Surface Engineering, Department of Engineering Design and Manufacture, University of Hull, Hull
关键词
D O I
10.1016/0257-8972(90)90099-X
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Potentiodynamic methods were used to investigate the relative corrosion protection provided on 304 stainless steel by various coating and pretreatment routes designed to isolate the substrate from the environment. These include combinations of plasma oxidizing, plasma nitriding and chromium, nickel and titanium nitride coatings produced by triode ion plating methods. It is shown that optimization of the layer structure and galvanic coupling are vital where a combination of wear and corrision resistance is required. Nickel interlayers under TiN, for example, are shown to provide improved protection against corrosion. Attempts to increase corrosion resistance by producing a passive layer through a d.c. plasma processing stage on the substrate were not so successful, and the reasons for this are discussed.
引用
收藏
页码:481 / 492
页数:12
相关论文
共 12 条
[1]   A STUDY OF THE CORROSION BEHAVIOR OF TIN FILMS [J].
ERDEMIR, A ;
CARTER, WB ;
HOCHMAN, RF ;
MELETIS, EI .
MATERIALS SCIENCE AND ENGINEERING, 1985, 69 (01) :89-93
[2]   PROCESS AND ENGINEERING BENEFITS OF SPUTTER-ION-PLATED TITANIUM NITRIDE COATINGS [J].
JACOBS, MH .
SURFACE & COATINGS TECHNOLOGY, 1986, 29 (03) :221-237
[3]   CORROSION BEHAVIOR AND PROTECTIVE QUALITY OF TIN COATINGS [J].
MANTYLA, TA ;
HELEVIRTA, PJ ;
LEPISTO, TT ;
SIITONEN, PT .
THIN SOLID FILMS, 1985, 126 (3-4) :275-281
[4]  
MASSIANI Y, 1989, SURF COAT TECH, V33, P309
[5]  
Matthews A., 1985, SURF ENG, V1, P93
[6]  
PRYOR MJ, 1976, CORROSION, V1, P1192
[7]  
SHRIER LL, 1976, CORROSION, V1, P1150
[8]  
TAVI M, 1988, 12 WORLD C SURF FIN, P955
[9]   A STUDY OF DEFECTS IN SPUTTERED TIN COATINGS BY ELECTROCHEMICAL POLARIZATION [J].
TELAMA, A ;
MANTYLA, T ;
KETTUNEN, P .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06) :2911-2914
[10]   TIN FORMED BY EVAPORATION AS A DIFFUSION BARRIER BETWEEN AL AND SI [J].
TING, CY .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 21 (01) :14-18