FABRICATION AND PERFORMANCE OF HIGH MOMENT LAMINATED FEAIN THIN-FILM INDUCTIVE RECORDING-HEADS

被引:7
作者
WANG, S
LIU, F
MARANOWSKI, KD
KRYDER, MH
机构
[1] Data Storage Systems Center, Dept. of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh
基金
美国国家科学基金会;
关键词
D O I
10.1109/20.312273
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Experimental thin film inductive heads using previously developed laminated FeAlN high moment soft magnetic materials have been designed, and fabricated to the wafer level. The heads, with a gap length of 0.2 mum and trackwidths varying from 6 to 84 mum, were fabricated with a mainly dry process. The dynamic domain patterns of the top magnetic poles were observed with a high speed wide-field Kerr microscope. Closure domains were not present, while multiple easy-axis domains were observed in the head yokes. The head inductances were measured from 1 to 50 MHz with a network analyzer. The electrical and magnetic testing results show that the fabricated heads function well at the wafer level and that laminated FeAlN high moment material is a very promising candidate for future high-density recording head applications.
引用
收藏
页码:281 / 286
页数:6
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