LOW-TEMPERATURE INTERDIFFUSION IN COPPER-GOLD THIN-FILMS ANALYZED BY HELIUM BACKSCATTERING

被引：16

作者：

CAMPISAN.SU ^{[1
]}

FOTI, G ^{[1
]}

GRASSO, F ^{[1
]}

RIMINI, E ^{[1
]}

机构：

[1] UNIV CATANIA,IST STRUTTURA MAT,CORSO ITALIA,5795129 CATANIA,ITALY

来源：

THIN SOLID FILMS | 1973年 / 19卷 / 02期

关键词：

D O I：

10.1016/0040-6090(73)90070-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：339 / 348

页数：10

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