EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS

[1] ATTARDO MJ, 1970, J APPL PHYS, V41, P2382

[2] GRAIN-BOUNDARY DIFFUSION OF GOLD IN COPPER [J]. JOURNAL OF APPLIED PHYSICS, 1962, 33 (12) : 3569 - &

[3] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[4] STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY [J]. APPLIED PHYSICS LETTERS, 1971, 18 (07) : 284 - +

[5] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &

[7] HIRSCH PB, 1965, ELECTRON MICROS, P455

[8] LEYMONIE C, 1960, MEM SCI REV MET, V57, P285

[9] ROSENBERG RN, UNPUBLISHED

[10] Schintlmeister W., 1970, Planseeberichte fur Pulvermetallurgie, V18, P3

[1] ATTARDO MJ, 1970, J APPL PHYS, V41, P2382

[2] GRAIN-BOUNDARY DIFFUSION OF GOLD IN COPPER [J]. JOURNAL OF APPLIED PHYSICS, 1962, 33 (12) : 3569 - &

[3] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[4] STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY [J]. APPLIED PHYSICS LETTERS, 1971, 18 (07) : 284 - +

[5] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &

[7] HIRSCH PB, 1965, ELECTRON MICROS, P455

[8] LEYMONIE C, 1960, MEM SCI REV MET, V57, P285

[9] ROSENBERG RN, UNPUBLISHED

[10] Schintlmeister W., 1970, Planseeberichte fur Pulvermetallurgie, V18, P3