GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS

被引：259

作者：

CHAUDHAR.P

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1972年 / 9卷 / 01期

关键词：

D O I：

10.1116/1.1316674

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：520 / &

共 8 条

[1]

CHAN RW, 1965, PHYSICAL METALLURGY, P974

[2] MECHANISMS OF STRESS RELIEF IN THIN FILMS [J].

CHAUDHARI, P ;

MADER, S ;

FREEDMAN, JF .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04) :618-+

[3] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].

CHAUDHARI, P .

[4]

Chopra K.L., 1969, THIN FILMS PHENOMENA, P844

[5]

HOFFMAN RW, 1966, PHYS THIN FILMS, P211

[6] INTRINSIC STRESS IN EVAPORATED METAL FILMS [J].

KLOKHOLM, E ;

BERRY, BS .

[7]

PENNEBAKER WB, 1968, RC2015 IBM RES REP

[8]

Timoshenko S., 1951, THEORY ELASTICITY, P399