TEMPERATURE-DEPENDENCE OF THERMOPHYSICAL PROPERTIES OF GAAS/ALAS PERIODIC STRUCTURE

被引:146
作者
YU, XY
CHEN, G
VERMA, A
SMITH, JS
机构
[1] DUKE UNIV, DEPT MECH ENGN & MAT SCI, DURHAM, NC 27708 USA
[2] UNIV CALIF BERKELEY, DEPT ELECT ENGN & COMP SCI, BERKELEY, CA 94720 USA
关键词
D O I
10.1063/1.114919
中图分类号
O59 [应用物理学];
学科分类号
摘要
This work investigates the temperature dependence of CaAs/AlAs thin-film structures. Based on an ac calorimetric method, the thermal diffusivity of a 700 Angstrom/700 Angstrom GaAs/AlAs periodic structure is measured from 190 to 450 K. Thermal conductivity of the structure is derived from the experiment. The results demonstrate that the thermal conductivity/diffusivity of the structure are lower than its corresponding bulk values. The temperature dependence of its thermophysical properties is weaker than that of typical bulk III-V materials. Interface scattering is believed as the major cause of the observed reduction in thermal conductivity. (C) 1995 American Institute of Physics.
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页码:3554 / 3556
页数:3
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