DEPTH-PROFILING ANALYSIS OF POLYIMIDE FILMS ON COPPER SUBSTRATES

被引：11

作者：

ISHIDA, H

KELLEY, K

机构：

[1] Department of Macromolecular Science, Case Western Reserve University, Cleveland

来源：

POLYMER | 1991年 / 32卷 / 09期

关键词：

POLYIMIDE; COPPER; FT-IR;

D O I：

10.1016/0032-3861(91)90392-V

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

In understanding the degradation of polyimide films on copper substrates at elevated temperatures, it is important to know where in the film degradation is initiated. This study uses Fourier-transform infra-red spectroscopy in combination with a chemical depth-profiling technique to investigate the interaction of various layers of a polyimide film cast on a copper substrate. The films will be analysed under as-cast, partially cured and severely degraded conditions.

引用

页码：1585 / 1588

页数：4

共 14 条

[1] REFLECTION-ABSORPTION INFRARED SPECTROSCOPY OF CUPROUS-OXIDE [J].