PLASMA-ACTIVATED HIGH-RATE EVAPORATION USING A LOW-VOLTAGE ELECTRON-BEAM SYSTEM

被引:3
作者
SCHILLER, S
HOETZSCH, G
NEUMANN, M
MORGNER, H
ZYWITZKI, O
机构
[1] Fraunhofer Institute for Electron Beam and Plasma Technology, 01324 Dresden
关键词
Aluminum compounds - Coatings - Corrosion protection - Costs - Deposition - Electron beams - Evaporation - Plasma applications;
D O I
10.1016/0257-8972(94)90254-2
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Aluminium-oxide-coated plastic films have attained increasing economic importance. Decisive for their general use is the cost of coating. A major price determinant is the deposition rate. With reactive high rate evaporation of aluminium and aluminium oxide, commercial feasibility is attainable. High deposition rates of the order of 100 nm s(-1) or more do not yet, however, meet the targeted property requirements. It will be pointed out that progress can be attained by use of the plasma activation process. The present level of development will be illustrated. Finally, the direction and orientation for future research will be shown.
引用
收藏
页码:788 / 793
页数:6
相关论文
共 14 条
[1]   THE DEVELOPMENT OF GRAIN-STRUCTURE DURING GROWTH OF METALLIC-FILMS [J].
GROVENOR, CRM ;
HENTZELL, HTG ;
SMITH, DA .
ACTA METALLURGICA, 1984, 32 (05) :773-781
[2]  
LUNK A, 1978, THESIS E MORITZ ARND
[3]   FUNDAMENTALS OF ION PLATING [J].
MATTOX, DM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (01) :47-52
[4]   REVISED STRUCTURE ZONE MODEL FOR THIN-FILM PHYSICAL STRUCTURE [J].
MESSIER, R ;
GIRI, AP ;
ROY, RA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1984, 2 (02) :500-503
[5]  
Movchan B. A., 1969, Fizika Metallov i Metallovedenie, V28, P653
[6]  
SCHERER M, 1989, 7TH P INT C IPAT GEN, P181
[7]   PULSED MAGNETRON SPUTTER TECHNOLOGY [J].
SCHILLER, S ;
GOEDICKE, K ;
RESCHKE, J ;
KIRCHHOFF, V ;
SCHNEIDER, S ;
MILDE, F .
SURFACE & COATINGS TECHNOLOGY, 1993, 61 (1-3) :331-337
[8]  
SCHILLER S, 1992, 6TH P INT C VAC WEB, P46
[9]  
Schiller S., 1993, 36 SVC ANN TECHN C, P278
[10]  
SCHILLER S, 1994, 37TH P ANN TECH C SV