BN&Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响

被引：2

作者：

吕亚南 ^{[1
]}

李巧梅 ^{[1
]}

牟其伍 ^{[1
]}

文翰颖 ^{[2
]}

朱玲 ^{[2
]}

寿梦杰 ^{[2
]}

机构：

[1] 重庆大学物理学院

[2] 重庆大学材料科学与工程学院

来源：

发光学报 | 2015年 / 36卷 / 12期

关键词：

粘接层; 结温; 热导率; 环氧树脂复合材料; 温度分布;

D O I：

暂无

中图分类号：

TB332 [非金属复合材料];

学科分类号：

0805 ; 080502 ;

摘要：

自制BN/EP(环氧树脂)复合材料和Al2O3/EP复合材料作为LED灯PCB板和散热铝块之间的粘接层材料,采用精密钻孔的方法用高精度测温仪测量LED灯正常工作时的温度分布,讨论粘接层对结温的影响,并与COMSOL Multiphysics软件模拟结果进行对比分析。实验测量LED结温与模拟结温变化趋势基本一致,结温会随着粘接层厚度的增加而上升、随着粘接层复合材料热导率的增加先快速降低而后趋于平缓。最终得到PCB板和散热铝块间最佳粘接层厚度和粘接层复合材料配比,当BN的质量分数为60%时,BN/EP复合材料粘接层的热导率最高,此时LED结温为75.2℃,比纯环氧树脂粘接层LED的结温降低了27.6℃。而Al2O3/EP复合材料粘接层LED的最低结温为78.2℃,此时Al2O3的质量分数为50%。

引用

页码：1469 / 1476

页数：8

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BN&amp;Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响

BN&Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响