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Understanding longitudinal fin heat sink orientation sensitivity for light emitting diode (LED) lighting applica- tions. Petroski J. International Electronic Packaging Technical Conference and Exhibition . 2003
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Metallic wafer and chip bonding for LED packaging. Hsu C C,Wang S J,Liu C Y. The 5th Pacific Rim Conference on Lasers and Electro-Optics . 2003
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Thermal challenges facing new generation light emitting diodes(LEDs)for lighting applications. J.Petroski. Proceedings of SPIE the International Society for Optical Engineering . 2002
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Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management. Zhang Kai,Matthew M.F.Yuen,,David G.W.Xiao et al. IEEE 2008Electronic Components and Technology Conference . 2008