共 12 条
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Advanced Materials for High Temperature; High Performance; Wide Bandgap Power Modules[J] Chad B O'Neal;Brad McGee;Brice McPherson;Jennifer Stabach;Richard Lollar;Ross Liederbach;Brandon Passmore Journal of Electronic Materials 2016,
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Possible failure modes in Press-Pack IGBTs[J] Lukas Tinschert;Atle Rygg Årdal;Tilo Poller;Marco Bohlländer;Magnar Hernes;Josef Lutz Microelectronics Reliability 2015,
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Influence of the clamping pressure on the electrical; thermal and mechanical behaviour of press-pack IGBTs[J] T. Poller;S. D’Arco;M. Hernes;A. Rygg Ardal;J. Lutz Microelectronics Reliability 2013,
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Mechanical analysis of press-pack IGBTs[J] T. Poller;T. Basler;M. Hernes;S. D’Arco;J. Lutz Microelectronics Reliability 2012,
[9]
Ageing defect detection on IGBT power modules by artificial training methods based on pattern recognition[J] A. Oukaour;B. Tala-Ighil;B. Pouderoux;M. Tounsi;M. Bouarroudj-Berkani;S. Lefebvre;B. Boudart Microelectronics Reliability 2010,
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Power cycling on press-pack IGBTs: measurements and thermomechanical simulation[J] Paolo Cova;Gianni Nicoletto;Alessandro Pirondi;Marco Portesine;Maurizio Pasqualetti Microelectronics Reliability 1999,

