Direct-write assembly of three-dimensional photonic crystals:: Conversion of polymer scaffolds to silicon hollow-woodpile structures

被引：169

作者：

Gratson, GM

García-Santamaría, F

Lousse, V

Xu, MJ

Fan, SH

Lewis, JA ^{[1
]}

Braun, PV

机构：

[1] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

[2] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

[3] Univ Illinois, Dept Chem & Biomol Engn, Urbana, IL 61801 USA

[4] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA

[5] Fac Univ Notre Dame Paix, Lab Phys Solide, B-5000 Namur, Belgium

来源：

ADVANCED MATERIALS | 2006年 / 18卷 / 04期

关键词：

D O I：

10.1002/adma.200501447

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

3D Si hollow-woodpile photonic crystals are formed through the direct-write assembly of concentrated polyelectrolyte inks (rods similar to 1 mu m in diameter) followed by a sequential silica/silicon chemical vapor deposition process (see Figure). The direct conversion of 3D polymer microstructures to materials like silicon may enable such applications as photonic materials, low-cost microelectromechanical systems (MEMS), microfluidic networks for heat dissipation, and biological devices.

引用

页码：461 / +

页数：6

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