Reactions of solid copper with pure liquid tin and liquid tin saturated with copper

被引：65

作者：

Hayashi, A

Kao, CR

Chang, YA

机构：

[1] NATL CENT UNIV,DEPT CHEM ENGN,CHUNGLI 32054,TAIWAN

[2] UNIV WISCONSIN,DEPT MAT SCI & ENGN,MADISON,WI 53706

来源：

关键词：

D O I：

10.1016/S1359-6462(97)00129-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

[No abstract available]

引用

页码：393 / 398

页数：6

共 10 条

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[5] Kay P. J., 1976, T I MET FINISH, V54, P68
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[J]. METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1992, 23 (04): : 1323 - 1332
[9] Tu K. N., 1973, Acta Metallurgica, V21, P347, DOI 10.1016/0001-6160(73)90190-9
[10] KINETICS OF INTERFACIAL REACTION IN BIMETALLIC CU-SN THIN-FILMS
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