Improved Heat-Dissipating Silicone by Nano-materials for LED Packaging

被引：5

作者：

Cao, M. L. ^{[2
]}

Pang, F. Y. ^{[2
]}

Zhang, M. C. ^{[1
]}

Cheng, Z. J. ^{[1
]}

Gao, Y.

He, P. G. ^{[2
]}

Pan, L. K. ^{[1
]}

Sun, Z. ^{[1
]}

机构：

[1] East China Normal Univ, Dept Phys, Engn Res Ctr Nanophoton & Adv Instrument, Minist Educ, Shanghai 200062, Peoples R China

[2] East China Normal Univ, Dept Chem, Engn Res Ctr Nanophoton & Adv Instrument, Minist Educ, Shanghai 200062, Peoples R China

来源：

2008 2ND IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1-3 | 2008年

关键词：

LED packaging; Thermal conductivity; Nano-diamond;

D O I：

10.1109/INEC.2008.4585595

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

引用

页码：758 / +

页数：2

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