Ferroelectric polymer Langmuir-Blodgett films for nonvolatile memory applications

被引:143
作者
Ducharme, S [1 ]
Reece, TJ
Othon, CM
Rannow, RK
机构
[1] Univ Nebraska, Dept Phys & Astron, Lincoln, NE 68588 USA
[2] Univ Nebraska, Ctr Mat Res & Anal, Lincoln, NE 68588 USA
[3] Hewlett Packard Corp, Corvallis, OR 97330 USA
基金
美国国家科学基金会;
关键词
ferroelectric memory; ferroelectric polymer; Langmuir-Blodgett (LB) films; nonvolatile memory;
D O I
10.1109/TDMR.2005.860818
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We review the potential for integrating ferroelectric polymer Langmuir-Blodgett (LB) films with semiconductor technology to produce nonvolatile ferroelectric random-access memory (NV-FRAM or NV-FeRAM) and data-storage devices. The prototype material is a copolymer consisting of 70% vinylidene fluoride (VDF) and 30% trifluoroethylene (TrFE), or P(VDF-TrFE 70:30). Recent work with LB films and more conventional solvent-formed films shows that the VDF copolymers are promising materials for nonvolatile memory applications. The prototype device is the metal-ferroelectric-insulator-semiconductor (MFIS) capacitance memory. Field-effect transistor (FET)-based devices are also discussed. The LB films afford devices with low-voltage operation, but there are two important technical hurdles that must be surmounted. First, an appropriate method must be found to control switching dynamics in the LB copolymer films. Second, the LB technology must be scaled up and incorporated into the semiconductor-manufacturing process, but since there is no precedent for mass production of LB films, it is difficult to project how long this will take.
引用
收藏
页码:720 / 735
页数:16
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